Die Bonding

Hybrid SA is able to Bond Chips of different size and thickness on different types of substrates.

Positioning accuracy and other product specifications are determined in collaboration with the client.

Chips size: Side 0.2 - 10mm, Thickness 50µm
Substrates: Thick Film Ceramic, FR4, FR5, G10, G11, Rogers, Flex, Rigid Flex, IMS, Pyrex
Traceability: Wafer Mapping
Positionning Accuracy: Standard +/-30µm, Specific +/-15µm
Adhesives: Conductive - Non-Conductive, Silicone
Packaging: Wafer up to 8'', Waffle Pack 2''-4'', Gelpack
Adhesive Application: Stamping, Dispensing, Silk Screen Printing