Hybrid SA performs Flip-Chip assembly on electric modules, collaborating with clients to meet specific requirements. This advanced technique offers superior electrical performance, improved thermal management, and a smaller form factor.

Flip-chip enables higher I/O density and enhanced reliability through direct chip-to-substrate connections. While initially more complex, it proves cost-effective for high-volume production, making it an ideal solution for modern, high-performance electronic applications requiring compact design and robust performance.

Technical Details

Two assembly technologies

  • ICA: Isotropically Conductive Adhesive (+Underfill)
  • NCP: Non-Conductive Paste


Flip Chip - Technical Details

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