Hybrid SA is capable of performing surface mounting of electronic components on single or double-sided substrates. We specialize in assembling extremely small components, including sizes as tiny as 01005, and can handle production from the prototyping stage all the way up to runs exceeding 100,000 units.

Our advanced technology and skilled team ensure precision and reliability in every project, enabling us to meet the diverse and demanding requirements of our clients across various industries. Whether you need a few prototypes or large-scale production, we are equipped to deliver exceptional quality and performance.

IPC/JEDEC J-STD-020D et IPC-A-610. Class 3 is applied as standard.

Technical Details


  • Solder Paste Application: Printing With Mask or Silk Screen Dispensing
  • Substrates: Thick Film Ceramic, Rigid, Flex, Rigid Flex, IMS, Pyrex, etc.
  • Components Application: Up to 12'000 Components/Hour
  • Positioning Accuracy: +/-50µm
  • Components Types: Standard Boxes, from "01005", Prototyping
  • Standard IC & PLCC, QFN, BGA, CSP, Flip-Chip solder bump


SMD - Technical Details

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