Wire Bonding

Hybrid SA is able to wire bond bare chips with exceptional precision and reliability. Our specific knowledge, combined with the expertise of our trained personnel and the use of modern machinery, allows us to execute complex and high-density bonding plans.

Our capabilities extend to handling high bond counts, making us a trusted partner for projects requiring meticulous attention to detail and advanced bonding solutions. Whether your project involves prototyping or high-volume production, we are equipped to meet your needs with excellence.

Technical Details

Gold Wire Bonding (Ball Bonding)

  • Diameter: Standard 20µm - 30µm

Aluminium Wire Bonding (Wedge Bonding)

  • Diameter: Standard 18µm - 33µm

Chip pads

  • Min 50 x 50 µm


Wire Bonding - Technical Details

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